Our 55*65cm (550*650mm) FG step nano coated framed SMT stencil is the full-spec high-end (ceiling-level) product in the SMT stencil industry, integrating FG high-end stainless steel material, advanced step forming technology and ultra-thin nano super hydrophobic coating. FG is a high-end stainless steel material with optimized alloy ratio, strictly complying with international industry standards such as ASTM A240 and GB/T3280, featuring excellent corrosion resistance, high hardness and superior processing performance. This stencil is exclusively engineered to meet the high-precision printing needs of all types of complex precision PCBs, breaking through the limitations of ordinary stencils made of common stainless steel in handling high-density, multi-height, and ultra-fine-pitch components. As the top-tier ceiling-level SMT stencil, it combines the triple advantages of FG high-end stainless steel's durability, step precision and nano anti-adhesion, equipped with 1-2μm ultra-thin nano coating and precise step structure (step height 0.05mm-0.30mm, accuracy ±0.01mm) made of FG high-end stainless steel, effectively solving the pa-in points of uneven solder paste, adhesion, and residue in complex PCB printing. Adopting 6061-T6 high-strength aluminum alloy frame and German LPKF high-precision fiber laser cutting technology, it ensures stable tension, excellent flatness, and accurate solder paste deposition across the entire 55*65cm printing area. It is widely applicable to all complex precision PCB printing scenarios, including high-density interconnection (HDI) boards, chip-level packaging (CSP) PCBs, and multi-component mixed PCBs, perfectly compatible with most manual and automatic SMT printing machines, and becoming the first choice for high-end precision electronic manufacturing.
Integrating FG high-end stainless steel material, step forming technology and nano super hydrophobic coating, it is a real full-spec high-end ceiling-level SMT stencil. FG is a high-end stainless steel material with optimized alloy ratio, featuring excellent corrosion resistance, high hardness and superior processing performance, which lays a solid foundation for the stencil's ultra-high precision and long service life. The step structure made of FG high-end stainless steel is precisely formed, with step height accuracy up to ±0.01mm, which can perfectly match the height difference of multi-height components on complex precision PCBs; the 1-2μm ultra-thin nano coating has super anti-adhesion and corrosion resistance, avoiding solder paste adhesion and residue, ensuring clean and uniform solder paste release, and solving the printing pa-in points of complex PCBs that ordinary stencils cannot handle. This triple-core configuration makes it stand out in the industry and become the benchmark for high-end stencils.
As a ceiling-level stencil, it adopts full-spec high-end configuration, with aperture accuracy up to ±0.008mm, minimum aperture 0.08mm, and minimum pitch 0.15mm, which can easily meet the printing needs of all complex precision PCBs, including HDI boards, CSP packaging PCBs, multi-component mixed PCBs, and ultra-fine pitch circuit PCBs. It breaks through the technical limitations of ordinary stencils, ensuring accurate solder paste deposition even for ultra-small components and high-density circuits, and greatly improving the welding quality and product yield of complex PCBs.
Adopting German LPKF high-precision fiber laser cutting technology, combined with the excellent processing performance of FG high-end stainless steel, the aperture walls are smooth and free of burrs, with positioning accuracy up to ±0.005mm and flatness ≤0.01mm/m², ensuring consistent printing quality for each batch. The 30mm thick reinforced high-strength aluminum alloy frame has excellent rigidity and anti-deformation performance, maintaining stable tension during high-frequency printing, and avoiding printing errors caused by frame deformation. It is equipped with dynamic tension compensation function, which can automatically adjust tension to ensure stable printing effect even in harsh environments. The high hardness and corrosion resistance of FG high-end stainless steel also effectively avoid stencil wear and corrosion during long-term use, further enhancing the stability and service life of the product.
The 55*65cm size is a high-frequency specification for complex precision PCBs, perfectly suitable for most automatic SMT printing machines and high-precision production lines. It balances printing efficiency and precision, which is not only suitable for small-batch R&D prototyping of complex PCBs, but also can meet the mass production needs of high-end precision electronic products, with no MOQ limit (1 piece available), and supports rapid response to high-end customization needs.
We provide high-end flexible customization services according to your PCB Gerber files and complex precision printing needs, including FG step height, step position, stencil foil thickness, aperture design, and nano coating type. The standard 55*65cm FG step nano coated stencil orders support 24-hour fast delivery, and we offer free professional file inspection, optimization, and FG step design consultation to ensure the stencil perfectly matches your complex precision PCB printing needs.
The FG high-end stainless steel foil and nano coating greatly extend the service life of the stencil, which is 2-3 times that of ordinary step stencils and nano stencils made of common stainless steel; FG high-end stainless steel has excellent corrosion resistance and wear resistance, which can adapt to harsh industrial environments and reduce the frequency of stencil replacement. The one-time frame investment can be reused for multiple batches of production, reducing long-term production costs for high-end manufacturing. It is fully compatible with most manual and automatic SMT printing machines on the market, no additional equipment modification is needed, and it can be put into use immediately after receipt, with outstanding high-end cost performance and long-term economic benefits.