Our advanced HDI manufacturing capabilities deliver precision and reliability for complex PCB designs:
| Specification |
Capability |
| Layer Count |
4 to 14 layers of high-density interconnection |
| HDI Structure |
1st-order, 2nd-order, 3rd-order, and Any-layer interconnect |
| Min Trace Width/Spacing |
3mil (0.075mm) |
| Min Drill Size |
Mechanical: 0.15mm | Laser: 0.1mm (Microvia technology) |
| Materials |
High-TG materials including Sheng Yi, ITEQ, Nan Ya, and Rogers |
| Surface Finishes |
Immersion Gold (ENIG), Hard Gold, OSP, Immersion Silver, HASL (Lead/Lead-free) |