0.15mm HDI High Frequency Mixed Pressure Prototype Board PCB 1oz-4oz

We specialize in high-precision HDI high-frequency mixed-pressure PCBs. Adopting mixed lamination technology of high-frequency dielectric material and standard FR4 material, combined with HDI microvia stacked structure, the board balances high-frequency signal transmission performance and high-density wiring advantages. It solves the pa-in points of high cost of pure high-frequency boards and poor high-frequency performance of ordinary PCBs. It supports quick prototyping and small-batch mass production for communication and high-speed electronic equipment.

• Mixed lamination structure with low dielectric constant and low loss, stable high-frequency signal transmission and strong anti-interference ability
• HDI microvia technology with staggered blind and buried vias, high wiring density and high board utilization
• Accurate impedance control to meet signal integrity requirements of high-speed and high-frequency equipment
• Higher cost performance than full high-frequency boards, greatly reducing R&D and mass production costs
• 24–48 hours quick sample service in Shenzhen factory, supporting multi-layer precision mixed lamination

5G communication modules, RF radio frequency equipment, microwave radar, UAV control systems, high-speed servers, industrial high-frequency sensing equipment, smart home communication mainboards.

Support 1-2-1, 2-3-2 stacked HDI structure, multi-layer mixed pressure, impedance control, ENIG, silver immersion, HASL and other surface finishes, compliant with IPC Class 2/3 standards.